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INSPECTION CAPABILITIES

Inspection Speed ：            40 cm2/sec (2D+3D)

Minimum Component Size ：      0402 mm (01005 in.)

PCB Size：                     510 x 510 mm (20 x 20 in.)

Component Height Clearance：   50mm

PCB Thickness：                0.3 – 5 mm

Component Types Inspected ：   Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-                                    hole, odd-form,clips, connectors, header pins, and more

Component Defects：            Missing, polarity, tombstone, billboard, flipped, wrong part,                                  gross body andlead damage, and more 

Solder Joint and Other Defects:Gold finger contamination, excess solder, insufficient solder,                                  bridging,through-hole pins

3D Measurement Inspection :    Lifted Lead, package coplanarity, polarity dimple and chamfer                                  identification

Measurement Gage R&R :        <10% @="" ±3σ="" (±80μm="" process="">

Z Height Accuracy :            1μm on certification target

Z Height Measurement Range:    6mm at spec, 24mm capability

VISION SYSTEM & TECHNOLOGY

Imagers :                      Multi-3D sensors

Resolution :                   Sub 10 μm

Image Processing :             Autonomous Image Interpretation (AI2) Technology, Coplanarity                                  ａnd Lead Measurement

Programming Time:              <15 minutes="" (for="" established="">

CAD Import :                   Any column-separated text file with ref designator, XY, Angle,                                  Part no info;Valor process preparation

SYSTEM SPECIFICATIONS

Machine Interface:            SMEMA, RS232 and Ethernet

Power Requirements:           100-120 VAC or 220-240 VAC, 50/60Hz, 10 amp max.

System Dimensions :           110 x 127 x 139 cm (W x D x H)

Weight :                      ≈965 kg (2127 lbs.)

OPTIONS

Barcode Reader, Rework station, SPC Software, Alignment Target