INSPECTION CAPABILITIES
Inspection Speed ： 40 cm2/sec (2D+3D)
Minimum Component Size ： 0402 mm (01005 in.)
PCB Size： 510 x 510 mm (20 x 20 in.)
Component Height Clearance： 50mm
PCB Thickness： 0.3 – 5 mm
Component Types Inspected ： Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through- hole, odd-form,clips, connectors, header pins, and more
Component Defects： Missing, polarity, tombstone, billboard, flipped, wrong part, gross body andlead damage, and more
Solder Joint and Other Defects:Gold finger contamination, excess solder, insufficient solder, bridging,through-hole pins
3D Measurement Inspection : Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Measurement Gage R&R : <10% @="" ±3σ="" (±80μm="" process="">
Z Height Accuracy : 1μm on certification target
Z Height Measurement Range: 6mm at spec, 24mm capability
VISION SYSTEM & TECHNOLOGY
Imagers : Multi-3D sensors
Resolution : Sub 10 μm
Image Processing : Autonomous Image Interpretation (AI2) Technology, Coplanarity ａnd Lead Measurement
Programming Time: <15 minutes="" (for="" established="">
CAD Import : Any column-separated text file with ref designator, XY, Angle, Part no info;Valor process preparation
SYSTEM SPECIFICATIONS
Machine Interface: SMEMA, RS232 and Ethernet
Power Requirements: 100-120 VAC or 220-240 VAC, 50/60Hz, 10 amp max.
System Dimensions : 110 x 127 x 139 cm (W x D x H)
Weight : ≈965 kg (2127 lbs.)
OPTIONS
Barcode Reader, Rework station, SPC Software, Alignment Target
